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Such electronic equipment as cellular phones, personal digital assistants, and now also digital home appliances are becoming increasingly multifunctional with many advanced features and at the same time the miniaturization of such devices is developing at an ever increasing pace. The key factor that makes this development possible is the technologies involved in the packaging of semiconductors such as IC and LSI.In these fields we are able to respond to a wide range of customers' manufacturing processing needs with a broad spectrum of products, including state-of-the-art wafer-level CSP, wafer thinning process, TAB, COF, and FPC. In response to our customers' processes, uses and film thickness, particularly in the field of semiconductor packaging, by using photoresist film formation with ultrathick film in excess of several tens of µm through to hundred µm, we have developed a diverse lineup of products such as chemically amplified type or naphthoquinone photoresists and materials for wafer thinning process. In addition, we also provide solutions from the field of manufacturing equipment, for example, photoresist coating machines capable of highly uniform photoresist coating in excess of several tens of µm through to hundred µm high speed photoresist developing machine and wafer machine for wafer thinning process. |
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