  
|
 Resolution Enhancing Process
State of the Art Photoresists
- For ArF Excimer Laser (193nm) Immersion Lithography
- For ArF Excimer Laser (193nm)
- For EUV
- For Electron Beam
- For KrF Excimer Laser (248nm)
- For i-line (365nm)
- For g-line (436nm)
Materials for Planarizing Insulation and Interlayer Insulation Film
- Spin-on Inorganic Planarization and Insulation Source (SOG)
- Spin-on Organic Planarization and Insulation Source (SOG)
Materials for Dopant Diffusion Process
- High Concentrated Dopant Diffusion Source
Materials for Photolithography
- Photoresist Stripping Solution
- Photoresist Developing Solution
- Rinsing Solution
- Thinner
- Resin Solution for Cover Film
- High Purity Aqueous Resin Solution
- Resin for Nano Implint
Materials & Equipment for Wafer Thinning Process
|
▲TWM Series
▲TWR Series
|
- TWM Series [Applicable to 150, 200, 300 mm Wafers] (Wafer Bonding Machine)
- Removable Adhesive
- TWR Series [Applicable to 150, 200, 300 mm Wafers] (Support Plate Debonding Machine)
|
Non Spin Coaters / Spin Coaters / Developing Machines
| |
- TR6133UD [Applicable to 75, 100, 125, 150, 200 mm Wafers] (SOD / Photoresist Spin Coater)
- CS Series [Applicable to 75, 100, 125, 150, 200, 300 mm Wafers] (SOD / Photoresist Spin Coater System)
- CSH Series [Applicable to 75, 100, 125, 150, 200, 300 mm Wafers] (High-speed Photoresist Developing System)
|
UV Hardening Machines
|
TVC-8000 Series
|
- TVC-8000 Series [Applicable to 75, 100, 125, 150, 200 mm Wafers] (Vacuum UV Hardening Machine)
|
Chemical Supplying Machines
- TAS-1000 Series (Automatic Developer Diluting and Supplying Machine)
- TADR-2000 Series(Automatic Developer Concentration Controlling and Supplying Machine)
- OS Series(Automatic Chemical Supplying Machine)
|
