- [ January/11/2006 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at 7th IC PACKAGING TECHNOLOGY JAPAN.
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, January 18 - Friday, January 20, 2006 |
| Exhibit Products : |
- Materials for CSP / BUMP (Package Modules)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping Process
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating Process
- Super Thick Film Dry Film Resist for Plating Process
- Materials for MEMS
- Materials for TAB / COF
- High Flexibility Positive Photoresist for TAB / COF
- High Resolution Dry Film Resist for Semi-Additive Process
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process
- Non-Spin Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Back Processing Machine
- Wafer Removing Machine
- Removing Agent
|
| Contact : |
- Process Equipment
- Semiconductor & LCD Equipment Marketing Div.
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Div.
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials & Equipment for Wafer Thinning Process
- Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
