3D-Packaging Field

Proposing a new semiconductor manufacturing technology, i.e., multi-layer stacking.

Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency

Zero Newton Materials

  • Adhesive materials
    • TZNR A series
  • Thinners to remove adhesive materials
    • TZNR thinner