3D-Packaging Field
Proposing a new semiconductor manufacturing technology, i.e., multi-layer stacking.
Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency
Zero Newton Materials
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Adhesive materials
- TZNR A series
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Thinners to remove adhesive materials
- TZNR thinner