TOKYO OHKA KOGYO CO., LTD. (TOK) provides chemical products, such as photoresist, and equipment for semiconductors and liquid crystal displays.

HOME Products New Business Field Materials Photo patternable permanent materials for structure fabrication(TMMF ®/ TMMR®)

New Business Field

Products

Under the “Challenge for the Future!” slogan, TOK has set up the New Business Development Dept. combined sales and technical division.
TOK offers unique and high value-added materials ,using our functional polymer design/manufacturing technologies cultivated in photolithography field, through open innovation with our customers and third parties.

Photo patternable permanent materials for structure fabrication(TMMF ®/ TMMR®)

Structure fabrication materials for MEMS with high resolution and high aspect ratio

Film thickness 130mm(10mm Dot, L/S)

Features

  • These photoresists provide a negative photosensitive permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns.
  • We have two types: liquid type(TMMR® S2000) and film type(TMMF® S2000).If combined, it is possible to form of hollow structures through the tenting process using film photoresists.
  • Compared with conventional the sacrificial layer process, these photoresists enable significant process simplification.
  • Low cytotoxicity※

※Cytotoxicity was tested according to the ISO 10993-5 standard. IC50 (50% inhibitory concentration) : >100%

Hollow structure forming

  • TMMF® S2000 Series:Film type photoresist
  • TMMR® S2000 Series:Liquid type photoresist
tmmf_1_E_ ver2

Applications

  • MEMS (Micro Electro Mechanical Systems)
  • Biochips (Microfluidics: μTAS, Lab on a chip)

Post Cured Film Performance / Chemical Resistance

Post Cured Film Performance
Physical propertiesMeasurementTMMF®S2000 & TMMR®S2000
Tg (℃)DMA230
CTE (ppm/℃)TMA65
Tensile strength (MPa)Tension60.3
Elongation (%)4.4
Young’s modulus (GPa)2.1
5% Thermal decomposition (℃)TG/DTA320
Vickers Hardness (HV)Push-In28.1
Martens Hardness (N/㎟)199
Young’s modulus (GPa)3.8
Water absorption (%)23 ℃-24 h dipping1.8
Transmittance (%)500 nmUV93
600 nm95
700 nm98
800 nm99
Post Cure Chemical Resistance
CategoryChemicalDippingResult
SolventNMP80 ℃-15 minNo change
GBL80 ℃-15 minNo change
EL23 ℃-15 minNo change
Acetone23 ℃-15 minNo change
PGMEA23 ℃-15 minNo change
IPA23 ℃-15 minNo change
DMSO80 ℃-15 minNo change
Alkaline solution25% NaOH40 ℃-10 minNo change
10% KOH40 ℃-10 minNo change
TMAH 2.38%40 ℃-10 minNo change
Acid solutionH2SO4/H2O240 ℃-10 minNo change
1% HF23 ℃-5 minNo change

References

High-resolution permanent photoresist laminate for microsystem applications, J. Micro/Nanolith. MEMS MOEMS 7 (3), 2008, 033009-1-6
Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges, ICQNM 2011 : The Fifth International Conference on Quantum, Nano and Micro Technologies, 71-76
High-resolution permanent photoresist laminate TMMF for sealed microfluidic structures in biological applications, J. Micromech. Microeng, 21(2011), 1-9
HYBRID FABRICATION OF MICROFLUIDIC CHIPS BASED ON COC, SILICON AND TMMF DRY RESIST, Tech Dig IEEE Micro Electro Mech Syst, 23rd Vol.1, 2010, 400-403
Lab-on-a-Foil: microfluidics on thin and flexible films, Lab Chip, 2010, 10, 1365-1386
Low-Cost Technology for the Integration of Micro- and Nanochips into Fluidic Systems on Printed Circuit Board: Fabrication Challenges, International Journal on Advances in Systems and Measurements, vol 5 no 1 & 2, 2012, 11-21
Picoliter Droplet Dispenser with Integrated Impedance Detector for Single-cell Printing, ACTUATOR 2012, 13th International Conference on New Actuators, 18-20 June 2012, 418-421

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HOME Products New Business Field Materials Photo patternable permanent materials for structure fabrication(TMMF ®/ TMMR®)