New Business Field
Under the “Challenge for the Future!” slogan, TOK has set up the New Business Development Dept. combined sales and technical division.
TOK offers unique and high value-added materials ,using our functional polymer design/manufacturing technologies cultivated in photolithography field, through open innovation with our customers and third parties.
Photo patternable permanent materials for structure fabrication（TMMF ®/ TMMR®）
Structure fabrication materials for MEMS with high resolution and high aspect ratio
Features
- These photoresists provide a negative photosensitive permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns.
- We have two types: liquid type(TMMR® S2000) and film type(TMMF® S2000).If combined, it is possible to form of hollow structures through the tenting process using film photoresists.
- Compared with conventional the sacrificial layer process, these photoresists enable significant process simplification.
- Low cytotoxicity※
※Cytotoxicity was tested according to the ISO 10993-5 standard. IC50 (50% inhibitory concentration) : >100%
Hollow structure forming
- TMMF® S2000 Series：Film type photoresist
- TMMR® S2000 Series：Liquid type photoresist
Applications
- MEMS (Micro Electro Mechanical Systems)
- Biochips (Microfluidics: μTAS, Lab on a chip)
Post Cured Film Performance / Chemical Resistance
Post Cured Film Performance
| Physical properties | Measurement | TMMF®S2000 & TMMR®S2000 | |
|---|---|---|---|
| Tg (℃) | DMA | 230 | |
| CTE (ppm/℃) | TMA | 65 | |
| Tensile strength (MPa) | Tension | 60.3 | |
| Elongation (%) | 4.4 | ||
| Young’s modulus (GPa) | 2.1 | ||
| 5% Thermal decomposition (℃) | TG/DTA | 320 | |
| Vickers Hardness (HV) | Push-In | 28.1 | |
| Martens Hardness (N/㎟) | 199 | ||
| Young’s modulus (GPa) | 3.8 | ||
| Water absorption (%) | 23 ℃-24 h dipping | 1.8 | |
| Transmittance (%) | 500 nm | UV | 93 |
| 600 nm | 95 | ||
| 700 nm | 98 | ||
| 800 nm | 99 | ||
Post Cure Chemical Resistance
| Category | Chemical | Dipping | Result |
|---|---|---|---|
| Solvent | NMP | 80 ℃-15 min | No change |
| GBL | 80 ℃-15 min | No change | |
| EL | 23 ℃-15 min | No change | |
| Acetone | 23 ℃-15 min | No change | |
| PGMEA | 23 ℃-15 min | No change | |
| IPA | 23 ℃-15 min | No change | |
| DMSO | 80 ℃-15 min | No change | |
| Alkaline solution | 25% NaOH | 40 ℃-10 min | No change |
| 10% KOH | 40 ℃-10 min | No change | |
| TMAH 2.38% | 40 ℃-10 min | No change | |
| Acid solution | H2SO4/H2O2 | 40 ℃-10 min | No change |
| 1% HF | 23 ℃-5 min | No change |
References
High-resolution permanent photoresist laminate for microsystem applications, J. Micro/Nanolith. MEMS MOEMS 7 (3), 2008, 033009-1-6
Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges, ICQNM 2011 : The Fifth International Conference on Quantum, Nano and Micro Technologies, 71-76
High-resolution permanent photoresist laminate TMMF for sealed microfluidic structures in biological applications, J. Micromech. Microeng, 21(2011), 1-9
HYBRID FABRICATION OF MICROFLUIDIC CHIPS BASED ON COC, SILICON AND TMMF DRY RESIST, Tech Dig IEEE Micro Electro Mech Syst, 23rd Vol.1, 2010, 400-403
Lab-on-a-Foil: microfluidics on thin and flexible films, Lab Chip, 2010, 10, 1365-1386
Low-Cost Technology for the Integration of Micro- and Nanochips into Fluidic Systems on Printed Circuit Board: Fabrication Challenges, International Journal on Advances in Systems and Measurements, vol 5 no 1 & 2, 2012, 11-21
Picoliter Droplet Dispenser with Integrated Impedance Detector for Single-cell Printing, ACTUATOR 2012, 13th International Conference on New Actuators, 18-20 June 2012, 418-421
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