New Business Field

Under the “Challenge for the Future!” slogan, TOK has set up the New Business Development Dept. combined sales and technical division.
TOK offers unique and high value-added materials ,using our functional polymer design/manufacturing technologies cultivated in photolithography field, through open innovation with our customers and third parties.
Photo Patternable Adhesives Materials
Pattern & Adhesive in One Material

Features
- Photo Patternable Adhesive Materials for Wafer-Level Microfluidic Device Fabrication
- Enable to make patterns by photolithography process
- Permanent resist with high adhesive property
- Low autofluorescence, Low cytotoxicity※
※Cytotoxicity was tested according to the ISO 10993-5 standard. IC50 (50% inhibitory concentration) : >100%

Applications
- MEMS (Micro Electro Mechanical Systems)
- Biochips (Microfluidics: μTAS, Lab on a chip)
Post Cured Film Performance / Chemical Resistance
Post Cured Film Performance
Physical properties | Measurement | Photo Patternable Adhesive | |
---|---|---|---|
Tg (℃) | DMA | 220 | |
CTE (ppm/℃) | TMA | 45 | |
Tensile strength (MPa) | Tension | 103 | |
Elongation (%) | 15.0 | ||
Young’s modulus (GPa) | 0.7 | ||
5% Thermal decomposition (℃) | TG/DTA | 295 | |
Water absorption (%) | 23 ℃-24 h dipping | 1.2 | |
Transmittance (%) | 400 nm | UV | 54.5 |
500 nm | 92.0 | ||
600 nm | 98.5 | ||
700 nm | 99.2 |
Post Cure Chemical Resistance
Category | Chemical | Dipping | Result |
---|---|---|---|
Solvent | NMP | 80 ℃-15 min | No change |
GBL | 80 ℃-15 min | No change | |
EL | 23 ℃-15 min | No change | |
Acetone | 23 ℃-15 min | No change | |
PGMEA | 23 ℃-15 min | No change | |
IPA | 23 ℃-15 min | No change | |
DMSO | 80 ℃-15 min | No change | |
Alkaline solution | 25% NaOH | 40 ℃-10 min | No change |
10% KOH | 40 ℃-10 min | No change | |
TMAH 2.38% | 40 ℃-10 min | No change | |
Acid solution | H2SO4/H2O2 | 40 ℃-10 min | No change |
1% HF | 23 ℃-5 min | No change |
Related Materials
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