- [ November/09/2001 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON Japan 2001
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, December 5 - Friday, December 7, 2001 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For Electron Beam (Positive Type / Negative Type)
- For F2 Laser (157nm)
- For ArF Excimer Laser (193nm)
- For CARL Process
- Photoresists for Semiconductor
- For KrF Excimer Laser (248nm) (HAER / LAER / For Implant Process / Negative Type)
- For Advanced i-line Process
- Other Products for Semiconductor
- Etching Residues Stripping Solution
- Anti-Reflective Coating (Photoresist-Surface Coating Type)
- Anti-Reflective Coating on the Bottom Layer of Photoresist
- Low-k Materials & Equipment for Low-k Materials
- Low-k Spin on Inorganic Planarization Source
- Low-k Spin on Organic Planarization Source
- Stripping Solution for Low-k Materials
- Spin-Coater for Low-k Materials
- Ashing Machine for Low-k Materials
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine for 300mm Wafer
- Low-Damage Ashing Machine for 200mm Wafer
- Low-Damage Etching Machine for 200mm Wafer
- Spin Coater for 300mm Wafer
- Spin Coater for 200mm Wafer
- Photoresists & Equipment Respond to Package Modules
- Photoresists for Wafer Level CSP
- Photoresists for Interposer (Tape) Type CSP
- High Aspect Ratio Performance Photoresists
- Dry Film Laminator for Wafer Level CSP
- Cover Film Remover for Wafer Level CSP
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