Tokyo Ohka Kogyo Co., Ltd. (TOK) provides chemical products, such as photoresist, and equipment needed to manufacture semiconductors and flat panel displays (FPD).

Dry Film Resists for Fine Pattern Process

• Thin Dry Film Resist for Subtractive Process
• Dry Film Resist for Semi-Additive Process
• Dry Film Resist for Plating Process of Extra-High Aspect Ratio Pattern
• Dry Film Resist for Electroless / Electro Gold Plating Process
• Dry Film Resist for 365nm UV laser direct image photo exposure process

Photoresists for COF / CSP / TAB

• Liquid Type Photoresist for Cu Wiring Etching Process
• Liquid Type Resin for Through-Hole Filling in Process(Back Coat)

Photoresists for Wafer Level CSP

• Liquid Type Photoresist for Re-Wiring Patterning Process(Plating Method)
• Extra-Thick Dry Film Resist for thick Film Bump Plating Process
• Liquid Type Photoresist for thick Film Bump Plating Process

Process Equipment for Packaging

• Dry Film laminator for Wafer Level CSP Process
• Cover Film Remover for Wafer Level CSP Process

Photoresists for Printed Wiring Board

• Excellent Conformability Dry Film Resist
• Less Contamination to Developing Bath Dry Film Resist
• General Use Dry Film Resist for Tenting
• General Use Dry Film Resist for Plating Process
• Dry Film Resist for Chemical Milling Process
• Photo Solder Resist
• Sodium Carbonate Developable Liquid Type Photoresist

Kenji Mori(Mr.) / Naoki Yamasaki(Mr.)

Image-forming Products Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)