- [ November/11/2002 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2002
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, December 4 - Friday, December 6, 2002 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For Electron Beam
(EPL / For Cr Mask / For Mask Production)
- For F2 Excimer Laser (157nm)
- For ArF Excimer Laser (193nm)
- Photoresists for Semiconductor
- For KrF Excimer Laser (248nm)
(HAER / LAER / For Implant Process / For Metal Process)
- For Most Advanced i-line (365nm)
(High Performance / Critical / For Implant Process)
- Resolution Enhancing Process for Semiconductor
- Materials for Resolution Enhancing Process
(For Electron Beam / ArF / KrF / i-line)
- Other Products for Semiconductor
- Etching Residues Stripping Solution
- Anti-Reflective Coating (Photoresist-Surface Coating Type)
- Anti-Reflective Coating on the Bottom Layer of Photoresist
- Low-k Materials & Equipment for Low-k Materials
- Low-k Spin-on Planarization Source
- Stripping Solution for Low-k Materials
(Etching Residues [Contains Si / Cu], Photoresist / Etching Residues [Contains Si / Cu])
- Spin-Coater for Low-k Materials
- Ashing Machine for Low-k Materials
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine for 300mm Wafer
- Low-Damage Ashing Machine for 200mm Wafer
- Low-Damage Etching Machine for 200mm Wafer
- Spin Coater for 300mm Wafer
- Spin Coater for 200mm Wafer
- Thick Film Forming Coater / Developer
- Multi-usage Coater / Developer
- Photoresists & Equipment for Package Modules
- Photoresists for Wafer Level CSP
(Metal Post / Bump / Re-Wiring)
- Photoresists for COF / Tape CSP / TAB
(Cu Wiring / Through-Hole Filling-in Process[Back Coat])
- Thick Film Forming Coater / Developer for CSP
- Dry Film Laminator for Wafer Level CSP
- Cover Film Remover for Wafer Level CSP
- High Aspect Ratio Performance Photoresists
- For Electron Beam
- For KrF Excimer Laser (248nm)
- For i-line (365nm)
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