- [ May/13/2003 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at JPCA Show 2003
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, June 4 - Friday, June 6, 2003 |
| Exhibit Products : |
- Dry Film Resists for Printed Wiring Board
- Thin Film High-Resolution Dry Film Resist for Subtractive Process
- High-Resolution Dry Film Resist for Semi-Additive Process
- Dry Film Resist for Plating Process of Extra-High Aspect Ratio Pattern
- Dry Film Resist for Electroless / Electro Gold Plating Process
- Dry Film Resist for 365nm UV laser direct image photo exposure process
- General Use Dry Film Resist
- Photo Solder Resist for Package
- Photoresists for COF / CSP / TAB
- Liquid Type Photoresist for Cu Wiring Etching Process
- Liquid Type Resin for Through-Hole Filling in Process(Back Coat)
- Photoresists for Wafer Level CSP
- Liquid Type Photoresist for Re-Wiring Patterning Process(Plating Method)
- Extra-Thick Dry Film Resist for thick Film Bump Plating Process
- Liquid Type Photoresist for thick Film Bump Plating Process
- Photoresists for Lead Frame
- Dry Film Resist for Lead Frame
- Dry Film Resist for Extra-Thick Plate Chemical Milling Process
|
| Contact : |
- Kenji Mori(Mr.) / Naoki Yamasaki(Mr.)
- Image-forming Products Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
For further information about Semiconductor Equipment Association of Japan (SEAJ), please visit their Homepage.
