Tokyo Ohka Kogyo Co., Ltd. (TOK) provides chemical products, such as photoresist, and equipment needed to manufacture semiconductors and flat panel displays (FPD).

State of the Art Photoresists for Semiconductor

• For F2 Excimer Laser (157nm)
• For Electron Beam
  (EPL / Low Energy EPL [Bi-/Tri-layer])
• For ArF Excimer Laser (193nm)
• For KrF Excimer Laser (248nm)
  (HAER / LAER / Thick Film, High Aspect Ratio)
• For i-line (365nm, Chemically Amplified Positive Photoresist)
  (Thick Film Process, Hight energy Implant)

Resolution Enhancing Process for Semiconductor

• Materials for Resolution Enhancing Process
  (For Electron Beam / ArF / KrF / i-line)
• Materials for Multilayer Process
  (Photoresist / Middle Layer Material / Bottom Layer Material)
• Materials for Bilayer Process
  (Photoresist / Bottom Layer Material)

Other Products for Semiconductor

• Etching Residues Stripping Solution

Low-k Materials & Equipment for Low-k Materials

• Low-k Spin-on Planarization Source
• Stripping Solution for Low-k Materials
  (Etching Residues [Contains Si / Cu], Photoresist / Etching Residues [Contains Si / Cu])
• Spin-Coater for Low-k Materials
• Ashing Machine for Low-k Materials

Process Equipment for Semiconductor

• Low-Damage Ashing Machine for 300mm Wafer
• Low-Damage Ashing Machine for 200mm Wafer
• Low-Damage Etching Machine for 200mm Wafer
• Spin Coater for 300mm Wafer
• Spin Coater for 200mm Wafer
• Thick Film Forming “Spinless” Coater “SLIDER”
• High Speed Photoresist Developing Machine “CS-H Series”
• Vacuum UV Hardening Machine

Materials for MEMS / CSP / BUMP (Package Modules)

• High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
• High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
• High Thick Film Negative Photoresist for CSP Flip Chip
• Super Thick Film Dry Film Resist for Plating

Equipment for MEMS / CSP / BUMP (Package Modules)

• Spin Coater for High Thick Film Forming Process
• “Spinless” Coater for Super Thick Film Forming Process
• High Speed Photoresist Developing Machine
• Descum Ashing Machine
• Vacuum UV Hardening Machine

Materials & Equipment for Wafer Thinning Process

• Wafer Bonding Machine
• Bonding Agent
• Wafer Removing Machine
• Removing Agent

High Aspect Ratio Performance Photoresists

• For KrF Excimer Laser (248nm)

Materials for Semiconductor

Electronic Material Marketing Division -1 / 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021

Process Equipment

Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021

Materials for MEMS / CSP / BUMP (Package Modules)

PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)