- [ January/13/2004 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at 5th IC PACKAGING TECHNOLOGY JAPAN
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, January 28 - Friday, January 30, 2004 |
| Exhibit Products : |
- Materials for MEMS / CSP / BUMP (Package Modules)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
- High Thick Film Negative Photoresist for CSP Flip Chip
- Super Thick Film Dry Film Resist for Plating
- High Resolution Dry Film Resist for Alkali Etching / Gold Plating
- High Aspect Ratio Performance Chemically Amplified Negative Photoresist
- Materials for COF
- High Resolution Dry Film Resist for Etching
- High Resolution Dry Film Resist for Plating
- High Flexibility Positive Photoresist for TAB / COF
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process
- “Spinless” Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Removing Machine
- Removing Agent
|
| Contact : |
- Process Equipment
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
