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HOME > News Release > Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® China 2004

News Release

[ March/01/2004 ]
Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® China 2004

This exhibition was successfully ended. We are grateful to you for your visiting our booth.

Exhibit Dates : Wednesday, March 17 - Friday, March 19, 2004
Exhibit Products :
State of the Art Photoresists for Semiconductor
  • For ArF Excimer Laser (193nm)
  • For KrF Excimer Laser (248nm)
    (HAER / LAER / For Implant Process)
  • For i-Line
  • For g-Line
Resolution Enhancing Process for Semiconductor
  • Materials for Resolution Enhancing Process
    (For Electron Beam / ArF / KrF / i-line)
Low-k Materials & Equipment
  • Low-k Spin-on Planarization Source
  • Stripping Solution for Low-k Materials
    (Etching Residues [Contains Si / Cu], Photoresist / Etching Residues [Contains Si / Cu])
  • Spin-Coater for Low-k Materials
  • Ashing Machine for Low-k Materials
Other Materials for Semiconductor
  • Photoresist Stripping Solution
  • Photoresist Developing Solution
  • Thinner
Process Equipment for Semiconductor
  • Low-Damage Ashing Machine for 300mm Wafer
  • Low-Damage Ashing Machine for 200mm Wafer
  • Low-Damage Etching Machine for 200mm Wafer
  • Spin Coater for 300mm Wafer
  • Spin Coater for 200mm Wafer
  • Thick Film Forming Coater
  • High Speed Photoresist Developing Machine
  • Vacuum UV Hardening Machine
Materials & Equipment for MEMS / CSP / BUMP (Package Modules)
  • Photoresists for Wafer Level CSP
    (Metal Post / Bump / Re-Wiring)
  • Photoresists for LCD Driver IC / Flip Chip Bump Forming Process
  • Photoresists for COF / Tape CSP / TAB
  • Photoresists for Lead Frame
  • Spin Coater for High Thick Film Forming Process
  • High Speed Photoresist Developing Machine
Materials for Flat Panel Display
  • Photoresist for TFT LCD (For g-line / i-line)
  • Photoresist for Forming Black Matrix of Color Filter
  • Material for LCD Planarization
  • Photoresist for Cr of Color Filter Etching Process
  • Photoresist Developing Solution
  • Stripping Solution
  • Thinner
Process Equipment for LCD
  • Coater System “Spinless”
    (Applicable to 1,500 by 1,850mm class substrate)
  • Coater System “Spinless
    (Applicable to 1,500 by 1,850mm class substrate)
  • Coater System Coat & Spin
    (Applicable to 1,100 by 1,300mm class substrate)
  • Coater / Developer System Coat & Spin
    (Applicable to 1,100 by 1,300mm class substrate)
  • Coater / Developer System Coat & Spin
    (Applicable to 650 by 750mm class substrate)
Contact :
Materials for Semiconductor
Electronic Material Marketing Division 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
Process Equipment
Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
Materials for LCD
LCD Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
Materials for MEMS / CSP / BUMP (Package Modules)
PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)


Representative Office
Tokyo Ohka Kogyo Co., Ltd. Shanghai Representative Office
TEL. +86-21-5840-8800 FAX. +86-21-5840-8884