- [ November/29/2004 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2004
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, December 1 - Friday, December 3, 2004 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For ArF Excimer Laser (193nm) Immersion Lithography
- For Electron Beam
(Mask Application / Low Energy EPL [Bi-/Tri-layer])
- For ArF Excimer Laser (193nm)
- For KrF Excimer Laser (248nm)
(HAER / LAER / Thick Film, High Aspect Ratio)
- For i-line (365nm, Chemically Amplified Positive Photoresist)
(Thick Film Process, High energy Implant)
- Resolution Enhancing Process for Semiconductor
- Materials for Resolution Enhancing Process
(For Electron Beam / ArF / KrF / i-line)
- Materials for Multilayer Process
(Photoresist / Middle Layer Material / Bottom Layer Material)
- Materials for Bilayer Process
(Photoresist / Bottom Layer Material)
- Other Products for Semiconductor
- Etching Residues Stripping Solution
(For Al Process / Cu Process / Al, Cu Process)
- Low-k Materials & Equipment
- Low-k Spin-on Planarization Source
- Stripping Solution for Low-k Materials
(Etching Residues [Contains Si / Cu])
- Spin-Coater for Low-k Materials
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine for 300mm Wafer
- Low-Damage Ashing Machine for 200mm Wafer
- Low-Damage Etching Machine for 200mm Wafer
- Spin Coater for 300mm Wafer
- Spin Coater for 200mm Wafer
- Thick Film Forming Non-Spin Coater
- Multi Wet Processor
- Vacuum UV Hardening Machine
- Materials for CSP / BUMP (Package Modules)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
- High Thick Film Negative Photoresist for CSP Flip Chip
- Super Thick Film Dry Film Resist for Plating
- Materials for MEMS
- High Aspect Ratio Performance Chemically Amplified Negative Permanent Photoresist
- Super Thick Film Dry Film Resist
- High Aspect Ratio Performance Chemically Amplified Positive Photoresist
- High Thick Film Positive Photoresist
- High Thick Film Chemically Amplified Negative Photoresist
- High Aspect Ratio Performance Photo-Induced Polymerization Type Negative Photoresist
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process
- Non-Spin Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Removing Machine
- Removing Agent
- High Aspect Ratio Performance Photoresists
- For KrF Excimer Laser (248nm)
|
| Contact : |
- Materials for Semiconductor
- Electronic Material Marketing Division -1 / 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Process Equipment
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
