Tokyo Ohka Kogyo Co., Ltd. (TOK) provides chemical products, such as photoresist, and equipment needed to manufacture semiconductors and flat panel displays (FPD).

Materials for CSP / BUMP (Package Modules)

• High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping Process
• High Sensitivity Thick Film Positive Photoresist for Thick Film Plating Process
• High Thick Film Negative Photoresist for CSP Flip Chip
• Super Thick Film Dry Film Resist for Plating Process

Materials for MEMS

• High Aspect Ratio Performance Chemically Amplified Negative Permanent Photoresist
• Super Thick Film Dry Film Resist
• High Aspect Ratio Performance Chemically Amplified Positive Photoresist
• High Thick Film Positive Photoresist
• High Thick Film Chemically Amplified Negative Photoresist
• High Aspect Ratio Performance Photo-Induced Polymerization Type Negative Photoresist

Materials for TAB / COF

• High Flexibility Positive Photoresist for TAB / COF
• Liquid Type Resin for Through-Hole Filling in Process(Back Coating)
• High Resolution Dry Film Resist for Semi-Additive Process
• High Resolution Dry Film Resist for h-Line Laser Direct Image

Equipment for MEMS / CSP / BUMP (Package Modules)

• Spin Coater for High Thick Film Forming Process
• Non-Spin Coater for Super Thick Film Forming Process
• High Speed Photoresist Developing Machine
• Descum Ashing Machine
• Vacuum UV Hardening Machine

Materials & Equipment for Wafer Thinning Process

• Wafer Bonding Machine
• Bonding Agent
• Wafer Back Processing Machine
• Wafer Removing Machine
• Removing Agent

Process Equipment

Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021

Materials for MEMS / CSP / BUMP (Package Modules)

PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)