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- [ January/14/2005 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Korea 2005
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, February 2 - Friday, February 4, 2005 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For ArF Excimer Laser (193nm) Immersion Lithography
- For ArF Excimer Laser (193nm)
- For KrF Excimer Laser (248nm)0(HAER / LAER)
- Resolution Enhancing Process for Semiconductor
- Materials for Immersion Lithography0
(Photoresist / Cover Coat Material)
- Materials for Bilayer Process0
(Photoresist / Bottom Layer Material)
- Low-k Materials
- Inorganic Low-k Spin-on Planarization Source
- Organic Low-k Spin-on Planarization Source
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine for 200mm Wafer, TCA-7800 Series
- Low-Damage Etching Machine for 200mm Wafer, TCE-7800 Series
- Thick Film Forming Coater, CS Series
- Multi Wet Processor, CSH Series
- Vacuum UV Hardening Machine, TVC-8000 Series
- Materials for MEMS / CSP / BUMP (Package Modules)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
- High Thick Film Negative Photoresist for CSP Flip Chip
- Super Thick Film Dry Film Resist for Plating
- High Flexibility Positive Photoresist for TAB / COF
- Liquid Type Resin for Through-Hole Filling in Process(Back Coating)
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process, CS Series
- Non-Spin Coater for Super Thick Film Forming Process, CSA Series
- High Speed Photoresist Developing Machine, CSH Series
- Descum Ashing Machine, TCA Series
- Vacuum UV Hardening Machine, TVC-8000 Series
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Back Processing Machine
- Wafer Removing Machine
- Removing Agent
- Materials for Flat Panel Display
- Pigment-Dispersed Photoresist for Forming Black Matrix of Color Filter
- Photoresist for TFT-LCD
- Transparency Material for Planarization
- Photoresist for Cr of Color Filter Etching Process
- Dry Film Resist for PDP Barrier Rib Forming Sand-Blast Process
- Dielectric Layer Sheet for PDP
- Dry Film Resist for PDP ITO / Bus Electrode / Address Electrode Etching Process
- Photo-Phosphor Paste for PDP
- Photo-Vehicle for PDP
- Liquid Resin for Glass-Frit Dispersion for PDP Panel Sealing Process
- Photoresist for Forming Cathode Separator (Reverse Taper Shape) of Organic EL Display
- Photoresist for Forming Insulator of Organic EL Display
- Process Equipment for LCD
- Coater System, Spinless TR117000 S Series
(Applicable to 1,950 by 2,250mm class substrate)
- Coater System, Spinless TR90000 S Series
(Applicable to 1,500 by 1,850mm class substrate)
- Coater / Developer System, Spinless TRD90000 S Series
(Applicable to 1,500 by 1,850mm class substrate)
- Coater System, Spinless TR63000 S Series
(Applicable to 1,100 by 1,300mm class substrate)
- Coater System, Coat & Spin TR63000 F Series
(Applicable to 1,100 by 1,300mm class substrate)
- Coater / Developer System, Spinless TRD63000 S Series
(Applicable to 1,100 by 1,300mm class substrate)
- Coater System, Spinless TR45000 S Series
(Applicable to 730 by 920mm class substrate)
- Coater System, Coat & Spin TR45000 F Series
(Applicable to 730 by 920mm class substrate)
- Coater System, Coat & Spin TR28000 F Series
(Applicable to 450 by 550mm class substrate)
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| Contact : |
- TOK KOREA CO., LTD.
- TEL. +82-2-588-5035 FAX. +82-2-588-5036
※Business Hours 9:00 - 12:00 13:00 - 18:00 in Korea
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)
- Materials for Semiconductor
- Electronic Material Marketing Division 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Process Equipment for Semiconductor / LCD
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for LCD / Organic ELD
- LCD Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials for PDP
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
*Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
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