- [ December/16/2008 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Korea 2009
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Tuesday, January 20 - Thursday, January 22, 2009 |
| Show Hours : |
10:00 - 17:00 (January 22; 10:00 - 16:00) |
| Venue : |
Convention and Exhibition Center (COEX) : Seoul, Korea |
| Booth No. : |
CONVENTION HALL (3F) No.5210 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For EUV
- For ArF Excimer Laser (193nm) Immersion Lithography
- Materials for ArF Double Patterning Process
- Materials for Semiconductor Photolithography
- Rinsing Solution for Developing
- Shrink material
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine
- Low-Damage Etching Machine
- Photoresist Spin Coater System
- Photoresists for Semiconductor Packaging
- High Flexibility Positive Photoresist for TAB / COF
- High Thick Film Chemically Amplified Positive Photoresist for Sn / Ag, Cu Bumping
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Adhesive
- Wafer Removing Machine
- Support Plate
|
| Contact : |
- TOK KOREA CO., LTD.
- TEL. +82-2-588-5035 FAX. +82-2-588-5036
* Business Hours 9:00 - 12:00 13:00 - 18:00 in Korea
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)
- Materials for Semiconductor
- Electronic Material Marketing Division - 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Process Equipment
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / Semiconductor Packaging (CSP / BUMP)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials & Equipment for Wafer Thinning Process
- Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
* SEMI and SEMICON are either registered trademarks or trademarks of SEMI.
