- [ January/13/2009 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at 10th IC PACKAGING TECHNOLOGY EXPO
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, January 28 - Friday, January 30, 2009 |
| Show Hours : |
10:00 - 18:00 (January 30; 10:00 - 17:00) |
| Venue : |
TOKYO BIG SIGHT |
| Booth No. : |
WEST HALL 2 No. 16-57 |
| Exhibit Products : |
- Materials for CSP / BUMP (Package Modules)
- Chemically Amplified Positive Photoresist for Sn / Ag, Cu Plating Process (PMER P-CH Series)
- High Resolution Positive Photoresist for Cu Wiring Forming Process (TMMR P-W Series)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping Process (PMER P-CA Series)
- Materials for TAB / COF
- High Flexibility Positive Photoresist for TAB / COF (PMER P-RH, P-RC Series)
- Materials for MEMS
- High Aspect Ratio Performance Chemically Amplified Negative Permanent Photoresist (TMMR Series)
- Super Thick Film Dry Film Resist (ORDYL P50000 Series)
- High Aspect Ratio Performance Chemically Amplified Positive Photoresist (PMER P-CA, P-CH Series)
- High Aspect Ratio Performance Chemically Amplified Negative Photoresist (PMER N-CA Series)
- Materials for TSV Process
- TSV Process Support
- Photoresist for Si Deep Etch (TNZR-E1050)
- Photoresist for Cu via fill (PC-0117B)
- Photoresist for Redistribution / Bump (PMER P-WA450, PC-0104B)
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process (CS Series)
- Non-Spin Coater for Super Thick Film Forming Process (CSA Series)
- High Speed Photoresist Developing Machine (CSH Series)
- Descum Ashing Machine (TCA Series)
- Vacuum UV Hardening Machine (TVC Series)
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine (TWM Series)
- Adhesive (TZNR Series)
- Wafer Removing Machine (TWR Series)
- Support Plate
|
| Contact : |
- Process Equipment
- Semiconductor & LCD Equipment Marketing Div.
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Div.
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials & Equipment for Wafer Thinning Process
- Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
