3D-Packaging Field
Proposing a new semiconductor manufacturing technology,
i.e., multi-layer stacking.
Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency
Zero Newton bonding machines
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TWM series
Integrated processing machines for bonding a carrier plate to a silicon wafer with high precision.
Zero Newton debonding machines
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TWR series
Integrated processing machines for debonding a silicon wafer from a carrier plate with low stress.