2026
-
INTERNEPCON JAPAN 2026
- Exhibit Dates
- Jan 21, 2026～Jan 23
- Venue
- Tokyo Big Sight Japan
- Exhibit Contents
- Materials for semiconductor packaging field
-
SEMICON China 2026
- Exhibit Dates
- Mar 25, 2026～Mar 27
- Venue
- Shanghai New International Expo Centre
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
-
ICEP-HBS2026
- Exhibit Dates
- Apr 14, 2026～Apr 18
- Venue
- International Conference Center Hiroshima
- Exhibit Contents
- Materials for semiconductor packaging field
-
CHEMINAS53
- Exhibit Dates
- May 14, 2026～May 15
- Venue
- Institute of Industrial Science, The University of Tokyo (Komaba Campus)
- Exhibit Contents
- MEMS, Microfluidics
-
ECTC 2026
- Exhibit Dates
- May 26, 2026～May 29
- Venue
- JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL
- Exhibit Contents
- Materials for semiconductor packaging field
-
Semicon India 2026
- Exhibit Dates
- Sep 17, 2026～Sep 19
- Venue
- New Delhi, India
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
-
MNE 2026
- Exhibit Dates
- Sep 21, 2026～Sep 24
- Venue
- Interlaken, Switzerland
- Exhibit Contents
- MEMS, Microfluidics, EB
-
Kyushu Semiconductor Industory Exhibition
- Exhibit Dates
- Sep 30, 2026～Oct 1
- Venue
- Marine Messe Fukuoka, Fukuoka, Japan Halls A and B
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process
-
Future Technologies 2026
- Exhibit Dates
- Nov 16, 2026～Nov 19
- Venue
- Kunibiki Messe Convention Center, Shimane, Japan
- Exhibit Contents
- MEMS, Microfluidics
-
SEMICON Japan 2026
- Exhibit Dates
- Dec 9, 2026～Dec 11
- Venue
- Tokyo Big Sight Japan
- Exhibit Contents
- Photoresist for semiconductor, materials for semiconductor packaging process