Exhibition Information

Exhibit Title	IC & SENSOR PACKAGING TECHNOLOGY EXPO	Exhibit Dates	Wed, Jan 15, 2020〜Fri, Jan 17
Venue	Tokyo Big Sight, Japan	Place
Offical website	https://www.tok.co.jp/eng/exhibition/1224/IC%20&%20SENSOR%20PACKAGING%20TECHNOLOGY%20EXPO	Exhibit Contents	Materials for Semiconductor Packaging Process