Semiconductor Packaging and MEMS Manufacturing Field
TOK's unique packaging / MEMS manufacturing technologies widely support the manufacturing of more compact electronics.
Offering TOK’s unique packaging / MEMS manufacturing technologies, in terms of both materials and equipment, that widely support the manufacturing of lighter, thinner and more compact mobile devices and electronic components with high functionality
Spin coaters with high functionality achieving cost effectiveness.
- Applicable to 100 / 125 / 150 / 200 / 300 mm Wafers
Automatic developing machines for single wafer processing with excellent production efficiency.
- Applicable to 150 / 200 / 300 mm Wafers
Vacuum UV hardning machines
Vacuum UV hardening machines with better heat resistance, etching property and plating resistance.
- Applicable to 100 / 125 / 150 / 200 mm Wafers