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TMMF®/TMMR®

Life Science-Related MaterialsPhoto Patternable Permanent Materials for Structure Fabrication/ Photo Patternable Adhesives Materials

Negative tone photo patterable permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns for MEMS (Dry film and liqud type)
Pattern & Adhesive in One Material

Features

  • These photoresists provide a negative photosensitive permanent film with high resolution and high adhesion, enabling the formation of high aspect ratio patterns.
  • We have two types: liquid type(TMMR® S2000) and film type(TMMF® S2000).If combined, it is possible to form of hollow structures through the tenting process using film photoresists.
  • Compared with conventional the sacrificial layer process, these photoresists enable significant process simplification.
  • Low cytotoxicity*
  • Photo Patternable Adhesive Materials for Wafer-Level Microfluidic Device Fabrication
  • Enable to make patterns by photolithography process
  • Permanent resist with high adhesive property
  • Low autofluorescence, Low cytotoxicity*

* Cytotoxicity was tested according to the ISO 10993-5 standard. IC50 (50% inhibitory concentration) : >100%

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Hollow structure forming

  • TMMF® S2000 Series:Film type photoresist
  • TMMR® S2000 Series:Liquid type photoresist

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Applications

  • MEMS (Micro Electro Mechanical Systems)
  • Biochips (Microfluidics: μTAS, Lab on a chip)

Post Cured Film Performance / Chemical Resistance

Post Cured Film Performance
Physical properties Measurement TMMF®S2000 & TMMR®S2000
Tg (℃) DMA 230
CTE (ppm/℃) TMA 65
Tensile strength (MPa) Tension 60.3
Elongation (%) 4.4
Young’s modulus (GPa) 2.1
5% Thermal decomposition (℃) TG/DTA 320
Vickers Hardness (HV) Push-In 28.1
Martens Hardness (N/㎟) 199
Young’s modulus (GPa) 3.8
Water absorption (%) 23 ℃-24 h dipping 1.8
Transmittance (%) 500 nm UV 93
600 nm 95
700 nm 98
800 nm 99
Post Cure Chemical Resistance
Category Chemical Dipping Result
Solvent NMP 80 ℃-15 min No change
GBL 80 ℃-15 min No change
EL 23 ℃-15 min No change
Acetone 23 ℃-15 min No change
PGMEA 23 ℃-15 min No change
IPA 23 ℃-15 min No change
DMSO 80 ℃-15 min No change
Alkaline solution 25% NaOH 40 ℃-10 min No change
10% KOH 40 ℃-10 min No change
TMAH 2.38% 40 ℃-10 min No change
Acid solution H2SO4/H2O2 40 ℃-10 min No change
1% HF 23 ℃-5 min No change
Post Cured Film Performance
Physical properties Measurement Photo Patternable Adhesive
Tg (℃) DMA 97
CTE (ppm/℃) TMA 63
Tensile strength (MPa) Tensile 39.8
Elongation (%) 5.5
Young’s modulus (GPa) 1.67
5% Thermal decomposition (℃) TG/DTA 399
Transmittance (%) 400 nm UV 84.7
500 nm 99.1
600 nm 99.2
700 nm 99.2
Post Cure Chemical Resistance
Category Chemical Dipping Result
Solvent NMP 23 ℃-15 min No change
GBL 23 ℃-15 min No change
EL 23 ℃-15 min No change
Acetone 23 ℃-15 min No change
PGMEA 23 ℃-15 min No change
IPA 23 ℃-15 min No change
DMSO 80 ℃-15 min No change
Alkaline solution 5% KOH 40 ℃-10 min No change
TMAH 2.38% 40 ℃-10 min No change
Acid solution 1% HF 23 ℃-5 min No change

References

High-resolution permanent photoresist laminate for microsystem applications, J. Micro/Nanolith. MEMS MOEMS 7 (3), 2008, 033009-1-6
Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges, ICQNM 2011 : The Fifth International Conference on Quantum, Nano and Micro Technologies, 71-76
High-resolution permanent photoresist laminate TMMF for sealed microfluidic structures in biological applications, J. Micromech. Microeng, 21(2011), 1-9
HYBRID FABRICATION OF MICROFLUIDIC CHIPS BASED ON COC, SILICON AND TMMF DRY RESIST, Tech Dig IEEE Micro Electro Mech Syst, 23rd Vol.1, 2010, 400-403
Lab-on-a-Foil: microfluidics on thin and flexible films, Lab Chip, 2010, 10, 1365-1386
Low-Cost Technology for the Integration of Micro- and Nanochips into Fluidic Systems on Printed Circuit Board: Fabrication Challenges, International Journal on Advances in Systems and Measurements, vol 5 no 1 & 2, 2012, 11-21
Picoliter Droplet Dispenser with Integrated Impedance Detector for Single-cell Printing, ACTUATOR 2012, 13th International Conference on New Actuators, 18-20 June 2012, 418-421

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