Proposing a new semiconductor manufacturing technology, i.e., multi-layer stacking.
Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency
Zero Newton bonding machines
Integrated processing machines for bonding a carrier plate to a silicon wafer with high precision.
Zero Newton debonding machines
Integrated processing machines for debonding a silicon wafer from a carrier plate with low stress.