Japanese

Products

3D-Packaging Field

Proposing a new semiconductor manufacturing technology, i.e., multi-layer stacking.

Presenting a new direction for the physical limits of miniaturization and proposing a new semiconductor manufacutring technology, i.e., multi-layer stacking, that promises better production efficiency

Zero Newton bonding machines

  • TWM series
    Zero Newton bonding machines TWM series

    Integrated processing machines for bonding a carrier plate to a silicon wafer with high precision.

Zero Newton debonding machines

  • TWR series
    Zero Newton debonding machines TWR series

    Integrated processing machines for debonding a silicon wafer from a carrier plate with low stress.