New Business Field
Under the “Challenge for the Future!” slogan, TOK has set up the New Business Development Dept. combined sales and technical division.
TOK offers unique and high value-added materials ,using our functional polymer design/manufacturing technologies cultivated in photolithography field, through open innovation with our customers and third parties.
Porous Polyimide Film
Unique and Uniformed pore structure
Features
- Open cell structure of spherical pores
- Extremely narrow pore size distribution
- High porosity (～80%)
- Low dielectric constant
- Thickness (10～100μm)
Applications
- Membrane for high efficiency removal
- Low dielectric material for high frequency printed circuit board
- Thermal insulation material
Film Performance
| Item | Unit | μm Pore | nm Pore | |
|---|---|---|---|---|
| Prosity | % | 70 | 70 | |
| Gurley | sec/100cc | 8～10 | 200～300 | |
| Strength | MPa | 25～35 | 25～40 | |
| Elongation | % | 20～25 | 20～40 | |
| Thermal decomposition | ℃ | 571 | 571 | |
| Dielectric | 1 GHz | ― | ― | 1.495 |
| 10 GHz | ― | 1.461 | ||
Membrane for high efficiency removal
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