Features
As a new microprocessing technology, the process using SAFIER offers numerous advantages.
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SAFIER is applicable to a diversity of processes (i-line, KrF, ArF, Bi-layer, EB and F
2
)
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SAFIER enables processing at lower temperatures than in the thermal flow process
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SAFIER reduces variation of pattern measurements
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SAFIER improves the pattern configuration
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With SAFIER, the photoresist patterns shrink while retaining pattern walls verticality
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With SAFIER, there is no significant variation in the contraction rate, regardless of the degree of pattern density
(Quite low pitch dependency)
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SAFIER can be removed by washing with pure water
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Contraction rate of SAFIER does not fluctuate much with temperature variation, SAFIER offers excellent controllability
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The process using SAFIER can be performed more than once
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The process using SAFIER is capable of application even in fields other than semiconductors
