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 Photoresists for Semiconductor Packaging (CSP / BUMP)
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
- Thick Film Positive Photoresist for Re-Wiring Patterning Process (Plating Method) of Wafer Level CSP
- High Flexibility Positive Photoresist for TAB / COF
Photoresists for Through Silicon Via (TSV)
- SiO2 Etching Photoresist for TSV
- Via Fill Photoresist for TSV
- Bump Photoresist for TSV
Materials for Photolithography
- Photoresist Stripping Solution
- Photoresist Developing Solution
- Rinsing Solution
- Thinner
Equipment for Semiconductor Packaging (CSP / BUMP)
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CS Series
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- CS Series [Applicable to 100, 125, 150, 200, 300 mm Wafers] (Photoresist Spin Coater System)
- CSA Series [Applicable to 100, 125, 150, 200, 300 mm Wafers] (Non Spin Coater System for Super Thick Film Forming Process)
- CSH Series [Applicable to 150, 200, 300 mm Wafers] (High-speed Photoresist Developing System)
- TVC-8000 Series [Applicable to 100, 125, 150, 200 mm Wafers] (Vacuum UV Hardening Machine)
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Materials & Equipment for Wafer Thinning Process
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▲TWM Series
▲TWR Series
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- TWM Series [Applicable to 150, 200, 300 mm Wafers] (Wafer Bonding Machine)
- Removable Adhesive
- TWR Series [Applicable to 150, 200, 300 mm Wafers] (Support Plate Debonding Machine)
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