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 Photoresists for MEMS
Materials for Photolithography
- Photoresist Stripping Solution
- Photoresist Developing Solution
- Rinsing Solution
- Thinner
Equipment for MEMS
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CSA Series
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- CS Series [Applicable to 100, 125, 150, 200, 300 mm Wafers] (Photoresist Spin Coater System)
- CSA Series [Applicable to 100, 125, 150, 200, 300 mm Wafers] (Non Spin Coater System for Super Thick Film Forming Process)
- CSH Series [Applicable to 150, 200, 300 mm Wafers] (High-speed Photoresist Developing System)
- TVC-8000 Series [Applicable to 100, 125, 150, 200 mm Wafers] (Vacuum UV Hardening Machine)
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Materials & Equipment for Wafer Thinning Process
- TWM Series [Applicable to 150, 200, 300 mm Wafers] (Wafer Bonding Machine / Support Mounting Machine)
- Bonding Agent
- TWR Series [Applicable to 150, 200, 300 mm Wafers] (Wafer Removing Machine / Support Removing Machine)
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