Tokyo Ohka Kogyo Co., Ltd. (TOK) provides chemical products, such as photoresist, and equipment needed to manufacture semiconductors and flat panel displays (FPD).

Materials for CSP / BUMP (Package Modules)

• Chemically Amplified Positive Photoresist for Sn / Ag, Cu Plating Process (PMER P-CH Series)
• High Resolution Positive Photoresist for Cu Wiring Forming Process (TMMR P-W Series)
• High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping Process (PMER P-CA Series)

Materials for TAB / COF

• High Flexibility Positive Photoresist for TAB / COF (PMER P-RH, P-RC Series)

Materials for MEMS

• High Aspect Ratio Performance Chemically Amplified Negative Permanent Photoresist (TMMR Series)
• Super Thick Film Dry Film Resist (ORDYL P50000 Series)
• High Aspect Ratio Performance Chemically Amplified Positive Photoresist (PMER P-CA, P-CH Series)
• High Aspect Ratio Performance Chemically Amplified Negative Photoresist (PMER N-CA Series)

Materials for TSV Process

• TSV Process Support
• Photoresist for Si Deep Etch (TNZR-E1050)
• Photoresist for Cu via fill (PC-0117B)
• Photoresist for Redistribution / Bump (PMER P-WA450, PC-0104B)

Equipment for MEMS / CSP / BUMP (Package Modules)

• Spin Coater for High Thick Film Forming Process (CS Series)
• Non-Spin Coater for Super Thick Film Forming Process (CSA Series)
• High Speed Photoresist Developing Machine (CSH Series)
• Descum Ashing Machine (TCA Series)
• Vacuum UV Hardening Machine (TVC Series)

Materials & Equipment for Wafer Thinning Process

• Wafer Bonding Machine (TWM Series)
• Adhesive (TZNR Series)
• Wafer Removing Machine (TWR Series)
• Support Plate (WSP Series)

Materials & Process Equipment for TSV/WLP/MEMS

High Density Integration Marketing Div. / Business Development Div.
TEL. +81-44-435-3001 FAX. +81-44-435-3021

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)