- [ September/11/2002 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at Semiconductor Manufacturing Technology Forum 2002 Visual Corner
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Monday, October 7 - Tuesday, October 8, 2002 |
| Exhibit Products : |
- Photoresists for Semiconductor
- For EUV
- For Electron Beam (EPL)
- For F2 Laser
- For ArF Excimer Laser
- For ArF Excimer Laser (for Bi-layer Process)
- For KrF Excimer Laser (L/S, ISO, C/H)
- For KrF Excimer Laser (for Damascene Process)
- For KrF Excimer Laser (for Bi-layer Process)
- For KrF Excimer Laser (Negative-Type)
- For i-line (L/S, C/H, Thin Film Implant Process, Metal Layer, TiN, Al, High Energy Implant)
- For i-line (Negative-Type)
- Other Products for Semiconductor
- Thinner for Semiconductor
- Low-k Materials
- Low-k Spin on Inorganic Planarization Source
- Low-k Spin on Organic Planarization Source
- Photoresists for Flat Panel Display
- Pigment Dispersed-Type Photoresist for Forming Black Matrix
- Dry Film Resist for Barrier Rib Forming Sand-Blast Process (for PDP)
- Photoresist for Forming Cathode Separator (for Organic ELD)
- Photoresists for CCD Camera
- Photoresist for Micro Lens
- Photoresists for Magnetic Head
- For Write Layer (for Electron Beam / Positive-Type)
- For Read Layer (for Electron Beam / Negative-Type)
- For Write Layer (for KrF Excimer Laser)
- For Write Layer (for i-line)
- Photoresists for Wafer Level CSP
- Highly Thick Film Photoresist for Forming Gold Bump
- Highly Thick Film Photoresist for Forming Metal Post
- Highly Thick Film Photoresist for Redistribution Plating Process
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For further information about Semiconductor Equipment Association of Japan (SEAJ), please visit their Homepage.
