- [ November/07/2005 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2005
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, December 7 - Friday, December 9, 2005 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For ArF Excimer Laser (193nm) Immersion Lithography
- For Electron Beam
- For ArF Excimer Laser (193nm)
- For KrF Excimer Laser (248nm)
- Resolution Enhancing Process for Semiconductor
- Materials for Resolution Enhancing Process
- Cover Coat for Immersion Lithography
- Materials for Multilayer Process
- Materials for Bilayer Process
- Materials for Semiconductor Photolithography
- Etching Residues Stripping Solution
- High-k Material
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine
- Low-Damage Etching Machine
- Photoresists for Semiconductor Packaging (CSP / BUMP)
- Super Thick Film Dry Film Resist for Plating
- High Flexibility Positive Photoresist for TAB / COF
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Sensitivity Thick Film Positive Photoresist for Thick Film Plating
- Photoresists for MEMS (High Aspect Ratio Performance Thick Film Photoresists)
- Super Thick Film Dry Film Resist
- Chemically Amplified Negative Permanent Photoresist
- Chemically Amplified Positive Photoresist
- Photo-Induced Polymerization Type Negative Photoresist
- Equipment for MEMS / Semiconductor Packaging (CSP / BUMP)
- Non-Spin Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Removing Machine
- Removing Agent
|
| Contact : |
- Materials for Semiconductor
- Electronic Material Marketing Division -1 / 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Process Equipment
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / Semiconductor Packaging (CSP / BUMP)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
