- [ December/27/2007 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at 9th IC PACKAGING TECHNOLOGY EXPO.
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, January 16 - Friday, January 18, 2008 |
| Show Hours : |
10:00 - 18:00 (January 18; 10:00 - 17:00) |
| Venue : |
TOKYO BIG SIGHT |
| Booth No. : |
EAST HALL 2 No. 13-3 |
| Exhibit Products : |
- Materials for CSP / BUMP (Package Modules)
- Chemically Amplified Positive Photoresist for Sn / Ag, Cu Plating Process
- High Resolution Positive Photoresist for Cu Wiring Forming Process
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping Process
- Materials for TAB / COF
- High Flexibility Positive Photoresist for TAB / COF
- High Resolution Dry Film Resist for Semi-Additive Process
- Materials for MEMS
- High Aspect Ratio Performance Chemically Amplified Negative Permanent Photoresist
- Super Thick Film Dry Film Resist
- High Aspect Ratio Performance Chemically Amplified Positive Photoresist
- High Aspect Ratio Performance Chemically Amplified Negative Photoresist
- Equipment for MEMS / CSP / BUMP (Package Modules)
- Spin Coater for High Thick Film Forming Process
- Non-Spin Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Bonding Agent
- Wafer Supporting Plate
- Wafer Removing Machine
- Removing Agent
|
| Contact : |
- Process Equipment
- Semiconductor & LCD Equipment Marketing Div.
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / CSP / BUMP (Package Modules)
- PDP Packaging Material Marketing Div.
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials & Equipment for Wafer Thinning Process
- Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
