- [ November/18/2008 ]
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2008
This exhibition was successfully ended. We are grateful to you for your visiting our booth.
| Exhibit Dates : |
Wednesday, December 3 - Friday, December 5, 2008 |
| Show Hours : |
10:00 - 17:00 |
| Venue : |
Makuhari Messe |
| Booth No. : |
2C-804 |
| Exhibit Products : |
- State of the Art Photoresists for Semiconductor
- For EUV
- For ArF Excimer Laser (193nm) Immersion Lithography
- For ArF Excimer Laser (193nm)
- For KrF Excimer Laser (248nm)
- Materials for ArF Double Patterning Process
- Materials for Multilayer Process (Photoresist / Middle Layer Material / Bottom Layer Material)
- Materials for Semiconductor Photolithography
- Etching Residues Stripping Solution (For Al / Cu Process)
- Top Coat (For Immersion / Non PFOS Top-ARC / Cover Film)
- Rinsing Solution for Developing
- Process Equipment for Semiconductor
- Low-Damage Ashing Machine
- Low-Damage Etching Machine
- Photoresist Spin Coater System
- Photoresists for Semiconductor Packaging
- High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
- High Flexibility Positive Photoresist for TAB / COF
- High Thick Film Chemically Amplified Positive Photoresist for Sn / Ag, Cu Bumping
- High Resolution Positive Photoresist for Cu Wiring Plating
- Photoresists for MEMS (High Aspect Ratio Performance Thick Film Photoresists)
- Chemically Amplified Negative Permanent Photoresist
- Non-antimonite Chemical Amplified Negative Permanent Photoresist
- Equipment for MEMS / Semiconductor Packaging (CSP / BUMP)
- Non-Spin Coater for Super Thick Film Forming Process
- High Speed Photoresist Developing Machine
- Descum Ashing Machine
- Vacuum UV Hardening Machine
- Materials & Equipment for Wafer Thinning Process
- Wafer Bonding Machine
- Adhesive
- Wafer Removing Machine
- Support Plate
|
| Contact : |
- Materials for Semiconductor
- Electronic Material Marketing Division -1 / 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Process Equipment
- Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
- Materials for MEMS / Semiconductor Packaging (CSP / BUMP)
- PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
- Materials & Equipment for Wafer Thinning Process
- Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021
* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays) |
* SEMI and SEMICON are either registered trademarks or trademarks of SEMI.
