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HOME > News Release > Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2008

News Release

[ November/18/2008 ]
Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON® Japan 2008

This exhibition was successfully ended. We are grateful to you for your visiting our booth.

Exhibit Dates : Wednesday, December 3 - Friday, December 5, 2008
Show Hours : 10:00 - 17:00
Venue : Makuhari Messe
Booth No. : 2C-804
Exhibit Products :
State of the Art Photoresists for Semiconductor
  • For EUV
  • For ArF Excimer Laser (193nm) Immersion Lithography
  • For ArF Excimer Laser (193nm)
  • For KrF Excimer Laser (248nm)
  • Materials for ArF Double Patterning Process
  • Materials for Multilayer Process (Photoresist / Middle Layer Material / Bottom Layer Material)
Materials for Semiconductor Photolithography
  • Etching Residues Stripping Solution (For Al / Cu Process)
  • Top Coat (For Immersion / Non PFOS Top-ARC / Cover Film)
  • Rinsing Solution for Developing
Process Equipment for Semiconductor
  • Low-Damage Ashing Machine
  • Low-Damage Etching Machine
  • Photoresist Spin Coater System
Photoresists for Semiconductor Packaging
  • High Thick Film Chemically Amplified Positive Photoresist for Gold Bumping
  • High Flexibility Positive Photoresist for TAB / COF
  • High Thick Film Chemically Amplified Positive Photoresist for Sn / Ag, Cu Bumping
  • High Resolution Positive Photoresist for Cu Wiring Plating
Photoresists for MEMS (High Aspect Ratio Performance Thick Film Photoresists)
  • Chemically Amplified Negative Permanent Photoresist
  • Non-antimonite Chemical Amplified Negative Permanent Photoresist
Equipment for MEMS / Semiconductor Packaging (CSP / BUMP)
  • Non-Spin Coater for Super Thick Film Forming Process
  • High Speed Photoresist Developing Machine
  • Descum Ashing Machine
  • Vacuum UV Hardening Machine
Materials & Equipment for Wafer Thinning Process
  • Wafer Bonding Machine
  • Adhesive
  • Wafer Removing Machine
  • Support Plate
Contact :
Materials for Semiconductor
Electronic Material Marketing Division -1 / 2
TEL. +81-44-435-3001 FAX. +81-44-435-3021
Process Equipment
Semiconductor & LCD Equipment Marketing Division
TEL. +81-44-435-3001 FAX. +81-44-435-3021
Materials for MEMS / Semiconductor Packaging (CSP / BUMP)
PDP Packaging Material Marketing Division
TEL. +81-44-435-3002 FAX. +81-44-435-3022
Materials & Equipment for Wafer Thinning Process
Business Development Section
TEL. +81-44-435-3001 FAX. +81-44-435-3021

* Business Hours 8:45 - 12:00 13:00 - 17:30 in Japan
(Except for Saturday, Sunday, National Holidays and Our Company Holidays)

* SEMI and SEMICON are either registered trademarks or trademarks of SEMI.